SMD placement
This process begins with the programming of the placement machine. We can program the placement machine manually or based on a Pick and Place file. The condition for machine placement is that the components arrive in manufacturer packaging. For resistors and capacitors, as well as other smaller components, tape packaging is usually used, while for integrated circuits, tray packaging may be available depending on the component size. For machine placement, it is recommended to apply solder paste on the PCBs using stencils. There are several options for this. We can work with both framed and frameless solder paste stencils. Frameless stencils can be made of copper or stainless steel. The simpler, frameless stencils are recommended for small batch productions and simpler circuit designs, as the uniformity of paste application cannot be guaranteed, which may lead to a high number of shorts after placement for densely pin-packed ICs and PPC/FPC connectors. We offer free repairs for shorts in small quantities (10-30 pieces). With framed, tensioned solder paste stencils, there is no […]