This process begins with the programming of the placement machine. We can program the placement machine manually or based on a Pick and Place file. The condition for machine placement is that the components arrive in manufacturer packaging. For resistors and capacitors, as well as other smaller components, tape packaging is usually used, while for integrated circuits, tray packaging may be available depending on the component size.

For machine placement, it is recommended to apply solder paste on the PCBs using stencils. There are several options for this. We can work with both framed and frameless solder paste stencils. Frameless stencils can be made of copper or stainless steel. The simpler, frameless stencils are recommended for small batch productions and simpler circuit designs, as the uniformity of paste application cannot be guaranteed, which may lead to a high number of shorts after placement for densely pin-packed ICs and PPC/FPC connectors. We offer free repairs for shorts in small quantities (10-30 pieces).

With framed, tensioned solder paste stencils, there is no need to worry about mass shorts, so this technique is preferable for larger volume productions and recurring manufacturing.

We are at your disposal to help you choose the correct technology from the design phase onwards, and we can assist in acquiring high-quality solder paste stencils.

Manual SMD Placement:

For prototype manufacturing or small batch production, we can carry out manual placement of circuit boards. There is also an option for manual paste application using a semi-automatic dispenser. In this case, we manually apply paste to the positions of the components to be placed, and then perform SMD placement using vacuum pipettes and ESD tweezers based on the placement drawing. After placement, we solder the boards using a reflow oven, so the final product visually does not differ from machine-placed products.

We can handle manual SMD placement from 0402 size to QFN packaged ICs. This technology is suitable for low quantities, possibly with a low component count per board.